LG Partners With Flex To Expand Global Data Center Cooling Solutions

LG Electronics has entered into a memorandum of understanding with Flex, provider of global manufacturing and data center infrastructure solutions. This agreement aims to jointly develop integrated cooling solutions to tackle the growing thermal management issues faced by AI-era data centres.

Advanced cooling technologies are essential for efficient heat dissipation in high-density data centres. The collaboration combines LG's air and liquid cooling modules, such as CRAC, CRAH, chillers, and coolant distribution units, with Flex's liquid cooling portfolio and IT infrastructure solutions. This partnership allows data center operators to customize solutions and scale according to demand.

LG is actively seeking opportunities to expand its data centre business globally. In Jakarta, Indonesia, the company secured an AI data center project that will be one of the largest in the country. Additionally, LG is working with DATAVOLT on projects in the Middle East and Africa and has been contracted to supply cooling solutions for a hyperscale data center in North America.

Furthermore, LG has partnered with LG Uplus to complete a proof-of-concept demonstrating advanced liquid cooling technology for data center thermal management. The company is also developing next-generation CDUs and cold plate solutions expected to be completed later this year, with commercialisation following soon after.

Building on its debut at Data Center World (DCW) in Washington D.C., LG showcased its latest cooling technologies at DCW Asia 2025 in Singapore. This move accelerates LG's efforts to expand its presence in the global market.

"Through our collaboration with LG, Flex now offers customers a complete range of cooling solutions to tackle escalating heat challenges in the data center," said Michael Hartung, president and Chief Commercial Officer at Flex. "Together, we'll deliver prefabricated, scalable data center infrastructure solutions that incorporate advanced liquid and air cooling technologies to increase efficiency, simplify deployment and speed time to revenue for our customers."

The co-developed solutions will be part of the Flex AI infrastructure platform. This platform is the first globally manufactured data centre platform integrating power, cooling, compute, and services into modular designs. Flex provides advanced manufacturing capabilities along with innovative power and cooling products that address power, heat, and scale challenges in AI-era data centers.

"We are advancing our competitiveness in the AI data centre market by strategically partnering with leading global companies," said James Lee, president of the LG ES Company. "Our collaboration with Flex adds new momentum to our global expansion and enhances our ability to deliver unique value to clients worldwide."